Der koreanische Speicher und NAND-Flash Gigant SK Hynix hat bekanntgegeben, dass der HBM2 Speicher ab Q3 2016 (July-September) marktreif ist. Die Firma will 4GB HBM2 Stacks im 4Hi-Stack (4-die-stack) Formfaktor mit 2 Geschwindigkeiten (2.00 Gbps (257 GB/s per Stack, Modellnummer H5VR32ESM4H-20C); und 1,6 Gbps (204 GB/s per Stack), Modellnummer H5VR32ESM4H-12C) verschiffen.
Mit vier solcher Stack können Grafikkarten mit einem 4096-bit HBM2 Interface und 16GB VRAM gebaut werden.
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